M1空焊:零件的四邊PIN腳因PCB的Layout過大,造成零件的PIN腳與PAD接觸不到,造成空焊.(如圖1)
M1 Void Soldering: Because of PCB layout, the bottom of these four pins of componment could not contact the PAD cause void soldering. Please refer to pic ture 1
JP1空焊:過爐後會板彎造成零件腳吃錫不良空焊.(如圖3)
JP1 void soldering: PCB would be bending after passing the reflow oven to cause the bottom of pins to solder insufficiently. Please refer to picture 3
JP4: 因JP4 PAD間隙.大於零件的間隙.PAD不合.導致零件會空焊.偏移(如圖2)
JP4: Due to the gap of JP4 PAD is bigger than the gap of component to made the component deviated and made it void soldering. Please refer to picture 2
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